Embedded World 2023

MAS Elettronica will be at the Embedded World Exhibition and Conference, which will take place in Nurnberg from the 14th to the 16th of March 2023. The Embedded World Fair offers the opportunity to share new ideas and projects and to meet experts, key leaders, partners, and qualified suppliers. For 20 years, the Embedded World Fair has been gathering hundreds of top players of the embedded community to show the most innovative technologies and discuss future developments and challenges. 

2023 Embedded World Exhibition and Conference will focus on three main areas

  • Embedded: the fair’s core business is to share ideas and solutions for the most complex embedded systems from sensors to cloud technologies and smart tools.
  • Responsibility: the embedded systems have been used in the most critical situations for medical applications and industrial automation. It is therefore necessary to focus on responsibility and accountability for these systems. 
  • Sustainability: it’s not a redundant refrain, but a must-have for the future of every company. It is necessary that embedded systems are sustainable in the whole life-cycle: from design to the final disposal. 

Where to find MAS Elettronica at #ew23 

MAS Elettronica will be hosted in three stands.

With Steliau, French industry leader in the electronic and mechatronic sector, we will show our SBC Mina, a Single Board Computer built upon the NXP i.MX 8M Mini embedded multicore applications processor. Thanks to its standard 3,5″ and SMARC 2.0 form factors, it is a solution that guarantees complete modularity. The TPM module ensures the system’s integrity and security, especially in the most critical contexts like medical and industrial. 

Together with the American Lattice Semiconductors and the European division of Arrow, we will show MAS LIFCL Evaluation Board. The board can be used for video capture applications. 

At the Embedded World Fair, we will present also NVidia SBC Lightfront AI, a board with high performance that is able to run modern AI workloads, making it possible to add advanced AI to any product.

Contact us for more information on the products shown at the Embedded World Exhibition and Conference: